◆ 薄型高度為2.0mm 之內。 Thin type 1.5mm in height.
◆ 表面貼裝為貼片型回流焊接。 SMT type and reflow-soldering for surface mounting.
◆ 可用于編帶和卷軸包裝。 Available for tape and reel package.
◆ 薄型高度為2.0mm 之內。 Thin type 1.5mm in height.
◆ 表面貼裝為貼片型回流焊接。 SMT type and reflow-soldering for surface mounting.
◆ 可用于編帶和卷軸包裝。 Available for tape and reel package.